E2Packman

Optical metrology and inspection solutions are essential in semiconductor manufacturing, ensuring precision and accuracy throughout the production process. Metrology tools measure critical dimensions—such as depths, step heights, thicknesses, and other key parameters—enabling real-time adjustments that enhance process control. Inspection tools, meanwhile, detect a wide range of defect types. Together, these tools help our customers by:

• Improving yield
• Accelerating time-to-market for new chip designs
• Reducing production costs

Heterogeneous packaging solutions, which integrate multiple dies, demand specialized metrology and inspection capabilities. As part of the E²PackMan project, Merck will develop new functionalities for the Advanced Metrology and Inspection platform to address advanced packaging process control challenges. New sensors will be designed and integrated, then evaluated on our metrology and inspection platforms using use cases identified and developed within the E²PackMan project

Merck will developpe advanced 3D optical metrology solutions to address the challenges of heterogeneous packaging. Their innovations include:

• Characterizing high aspect ratio TSVs and bumps with new materials to meet the demands of sophisticated interconnects.
• Metrology and inspection tools for RDL (Redistribution Layers) produced wafer test substrates.
• Advanced 3D surface metrology and process assessment, focusing on bonding yield and quality.
• Exploring overlay metrology for wafer-to-wafer (W2W) and die-to-wafer (D2W) approaches to further enhance packaging processes.