Thales Research & Technology

Thales is among the leading European manufacturers of equipment and electronic systems intended for the aerospace, transport, defense, and security sectors.

Its three core business segments are:

  • Aerospace, avionics equipment (cockpit equipment, cabin multimedia, simulation equipment) and space systems (satellites, payloads, etc.);
  • Defence: secure information (command and control systems, communication, protection, and cybersecurity systems, etc.),and communication systems defense mission systems (electronic warfare systems and drones), land and air systems (air defense systems, air traffic control, land defense systems and missiles, and optronic systems).
  • Cyber and Digital identification and security solutions.

Its key figures in 2024 are: 83 000 employees in 68 countries. Revenues of 20,6 B€ with more than 4 B€ of R&D, which of 1,1 of self-funded R&D.

In E2PACKMAN, Thales will be represented by one of its Research and Technology centers located in Palaiseau, near Paris, in France. Thales R&T is participating in the preparation of Thales industrial future in strategic R&D fields. With 1 Nobel Prize, 3 European Research Council projects and also 80 French or European on-going collaborative research projects, with 240 permanent staff and on going 40 PhD students, and 4,000 m² of clean rooms and 200 characterization & process main equipment.

Role

Thales is providing an important use-case application for advanced packaging focusing on computing solutions for avionics and covering different domains from the chiplet-based architecture (with CEA), to the evaluation in rugged environment passing through the electrical characterization of advanced high-speed interconnects. This use-case is proposed with Extoll.

Key Contribution

Thales will co-lead WorkPackage 7 with Infineon about the technological demonstrators. The use-case of computing solution for avionics will be built in coordination with the use-case leaded by Swissbit.

In addition and in coordination with other use-cases, Thales will be involved in the use of advanced substrates (with AT&S), advanced interconnects (with 3DIS, Micro-PackS and Nanowired), and advanced materials (with Roartis).

 

Thales Research & Technology

1 Avenue Augustin Fresnel
91767 Palaiseau
France
www.thalesgroup.com

Point of contact
Wilson MAIA
Email: wilson.maia@thalesgroup.com