Chemnitz University of Technology
With around 8,000 students and 2,300 employees, the Chemnitz University of Technology offers a broad array of degree programs and boasts a strong research infrastructure.
It is home to leading institutes specializing in material science, mechanical engineering, energy and environmental technology, as well as information and electrical engineering.
Its research profile includes a focus on power electronics, where investigations center on the robustness and reliability of semiconductor components under overload and power cycling conditions. Additional expertise lies in materials and microsystem reliability, with lifetime modeling based on failure physics and advanced material characterization. The Center for Micro and Nano Technologies rounds out the research portfolio with simulation-driven development of compact digital twins that enhance design reliability and enable predictive health management.
Role
The research focuses on the advancement of power electronic packaging, including the evaluation of innovative double-sided cooled molded modules and the development of custom test strategies for high power density devices.
Special attention is given to quantum computing applications through fracture mechanics investigations and method development targeting relevant material pairings. Additionally, studies explore material behavior under cryogenic conditions, analyzing degradation during rapid temperature transitions down to 4 K.
Novel simulation techniques within the Design for Reliability (DfR) domain address real-world field loads (WP2), complemented by experimental material characterization for cutting-edge packaging solutions (WP3). Long-term performance is also assessed via lifetime testing of smart power components and modules (WP6).
Key Contribution
Research activities focus on the reliability testing of power electronics using advanced semiconductor materials such as silicon (Si), silicon carbide (SiC), and gallium nitride (GaN). These efforts include in-depth failure-mode analysis, lifetime modelling, and the development of innovative test procedures, alongside precise thermal characterization using Zth measurements. Pioneering approaches have been introduced for material and reliability evaluation under cryogenic temperatures, supporting the scaling of Ion Trap architectures.
Novel Design for Reliability (DfR) methodologies are being applied throughout the value chain, leveraging finite element simulations and digital twin technology. Rigorous model calibration is achieved through experimental data, including local material characterization and 3D deformation measurements, while physical tests—such as thermal cycling and shock testing—ensure comprehensive validation of simulation results.
