TU Delft

Delft University of Technology is one of the world-wide leading universities focusing on fundamental and applied R&D to address various key society needs.

TUDelft provides top education and research situated at the heart of the oldest and largest technical university in The Netherlands. Our 8 faculties offer 16 BSc and more than 30 MSc programs. Our 25,000+ students and 6,000 employees share a fascination for science, design and technology. Our common mission: impact for a better society.

Role

  • Evaluate advanced packaging interconnect materials and interface, jointly develop and optimize the associated process technologies with the industrial partners to ensure packaging and module performance and reliability of novel devices (WP3)
  • Explore Interfaces for high-power applications using heterogeneous integration solutions and interfaces at PoP HDFO Systems (WP3)
  • Develop advanced processes to ensure packaging and module performance including reliability of novel WBG devices (e.g., GaN, and SiC, Chiplet). NanoCu based interconnect technology will be proposed to facilitate high performance and fine pitch applications. (WP4)
  • AI based “designing for reliability platform” for packaging
  • Disseminating results through publication is top journals
  • Training and education within TU Delft lectures

Key Contribution

  • Extending leadership by implementing advanced packaging solutions on WBG devices (power, sensors and photonics) with improved reliability and performance.
  • Go beyond good publications, making sure that the research activities will be closely aligned with the needs of our industrial partners in the consortium, and results be implemented by them.
 

TU Delft

Fac. EEMCS (building 36), EKL wing
Mekelweg 4
2628 CD Delft
Netherlands
www.tudelft.nl