STMicroelectronics
One of the world’s largest semiconductor companies with 50.000 employees, and 14 main manufacturing sites.
STMicroelectronics is actively involved in the project with a focus on the design and simulation of power packages, including the exploration of the new concept of immersive cooling power packages.
CATANIA site will participate – Power Front End manufacturing with special focus on SiC wafer level technology and R&D of power module packages
Role
First part of project: Specification and requirements (WP1): WP1 is the basis and starting point of the E2PackMan project. In this work package the specifications and requirements for advanced packaging are investigated and defined for the intended use cases
Second part of project: Additional contribution to WP2 (Design and Modeling), WP4 (Equipment and material), WP6(Reliability and Test)
Key Contribution
- R&D to set up the capability in producing advanced multichip - power packages with enhance performance and efficiency in power electronics
- Specialization in mobility technologies and develops green power and energy management solutions to meet global energy demands while minimizing environmental impacts
- Experimental characterization and reliability analysis for the immersive cooling power packages.
