Robert Bosch GmbH

The Bosch Group is a leading global supplier of technology and services. It employs roughly 412,000 associates worldwide (as of December 31, 2025). According to preliminary figures, the company generated sales of 91 billion euros in 2025. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology.

With its business activities, the company aims to use technology to help shape universal trends such as automation, electrification, digitalization, connectivity, and an orientation to sustainability. In this context, Bosch’s broad diversification across regions and industries strengthens its innovativeness and robustness. Bosch uses its proven expertise in sensor technology, software, and services to offer customers cross-domain solutions from a single source. It also applies its expertise in connectivity and artificial intelligence in order to develop and manufacture user-friendly, sustainable products. With technology that is “Invented for life,” Bosch wants to help improve quality of life and conserve natural resources.

Role

Power electronics products are key applications for all business units for Bosch. In outstanding assignment for the entities in the business field Mobility Solution. Therefore, novel assembly and interconnection technologies for SiC-MOSFET-based power modules with higher operating temperatures and power densities in automotive powertrain applications are under exploration. Understanding the basic characteristics of the involved materials in the hardware world and the virtual digital twin world within their system surrounding as power module is of highest interest. All the gained new knowledge and competencies will be verified by a power module use case demonstrator with increased robustness performance.

Key Contribution

Hardware integration of novel Cu-backend metallized SiC power MOSFETs by all copper near chip assembly and interconnection technologies and high temperature capable packaging material, up to 200°C and beyond, is the key feature in the E2PackMan project. Operating experimental and virtual Cu characterizations for chip’s top side and die-attach technologies in the state of ‘as produced’ and loaded after power cycling ageing condition is the necessary knowledge base for later industrialization. Project partners from academia will support this demand as industry partner by there analyzing and methodology competencies. The verification of the commonly achieved success will be provided with multi-chip wide-bandgap-based power module build-up and testing.