Prodrive Technologies B.V.

Prodrive Technologies

Prodrive Technologies operates with a mission to create technologies that benefit society, emphasizing sustainability and innovation.

Prodrive Technologies' product portfolio is diverse and includes high-performance computing systems, precision motion control, power conversion solutions, high-speed imaging and advanced manufacturing solutions.

Established in 1993, Prodrive has grown to become a prominent player in the fields of advanced electronics, energy infrastructure, medical systems, embedded systems, and mechatronics. The company specializes in the design, development, and manufacturing of high-quality and high-tech solutions across a wide range of industries, including semiconductor, automotive, healthcare, energy, and industrial automation.

The company's integrated approach encompasses the entire product lifecycle, from initial concept and design through to mass production and after-sales support. This vertical integration allows Prodrive to maintain rigorous quality control, reduce time-to market, and offer cost-effective solutions to its clients. One of the distinguishing features of Prodrive Technologies is its strong emphasis on research and development (R&D). The company invests significantly in R&D to foster innovation and stay ahead in the rapidly evolving technology landscape.

Role

In the E2-Packmann project Prodrive acts as country coordinator for the Netherlands. From a technical point of view, Prodrive will focus on developing new camera module designs to enhance thermal management, increase data throughput and reduce size. Additionally, Prodrive aims to improve packaging reliability through advanced particle detection, and by optimizing wire-bonding and adhesive-bonding processes.

Key Contribution

The key contribution from Prodrive will be the development and manufacturing of a use case with emphasis on bare die integration processes for camera solutions. The following contributions are expected:

A demonstrator for advanced bare die integration in high-throughput, compact image sensor systems.
Next-generation camera modules enabling higher resolution, thermal efficiency, and data rates for new possibilities in semicon, industrial, and medical markets.
Building European competence in ultra-reliable sensor packaging, leveraging innovations in wire-bonding, thermal management, and metrology.
Training and educating future experts through collaboration with leading research institutes and industrial partners in sensor integration.