PICadvanced
Founded in 2014 and based in Portugal, PICadvanced has around 55 R&D engineers developing disruptive solutions for the telecommunications and datacenter markets. The company offers products and services spanning photonic integrated circuit (PIC) design/layout, advanced electronic and photonic die packaging and testing, electronics design, manufacturing and assembly, with capabilities that, all together, enable fully assembled solutions for integrated demonstrators and market-ready products.
Through internal product developments and participation in several national and European funded projects, PICadvanced has built a strong track record across the PIC value chain, from optoelectronic architecture design to system-level integration via its proprietary packaging platform and dedicated electronic hardware development. PICadvanced operates two laboratories, focused on optical solutions, electronics testing and product compliance certification, and a cleanroom.
The cleanroom hosts a comprehensive set of advanced packaging and testing capabilities, including die inspection, SEM analysis, automated die bonding, flip chip assembly, and automated wire bonding (wedge, ball and ribbon bonding configurations), complemented by custom mechanical housing design and thermal management solutions. Optical interconnect processes are supported through active and passive fiber alignment and attach, photonic wire bonding, and lens microfabrication.
Role
PICadvanced will contribute its multi-pocket host platform alongside packaging, assembly, and simulation capabilities to advance optical and high-speed electrical connectivity for next-generation datacenter and telecom applications. This infrastructure supports the development of embedded die and fan-out solutions that enable denser optical-electrical integration, contributing to system miniaturization and high-speed signal integrity.
Key Contribution
PICadvanced will investigate new chiplet packaging techniques, with particular focus on die-to-die interfaces, including high-speed RF connectivity through co-integration of electronic and photonic dies. A key technical highlight will be the integration of microfabricated airbridge structures, enabling wafer-level fan-out of packaged photonic and electronic dies within the multi-pocket host platform.
PCI - Creative Science Park
Via do Conhecimento, Ed. Central
3830-352 Ílhavo
Portugal
