News
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E2PACKMAN General Assembly 2026 in Berlin
|From 1–3 June 2026, the E2PACKMAN consortium met in Berlin, hosted by Fraunhofer IZM, to review first-year achievements, discuss technical progress, and coordinate upcoming activities.
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EuWoRel 2025
|Since 2013, EuWoRel has been the annual forum for addressing the concerns of reliability, robustness, and functional safety of new products and technologies in the field of electronics and smart systems.
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F2F meeting in Regensburg
|The first f2f of the whole E2PACKMAN team took place for three days at Infineon Regensburg in November. More than 110 colleagues of the E2PACKMAN team participated. This event was a big success. It started with the General Assembly summarizing the status of the project. Again, the importance of assembly and packaging for the European microelectronic value chain was highlighted.
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Virtual kick-off week
|The E2PACKMAN kick-off was organized as a virtual kick-off week from June 30th to July 4th, 2025. It started with a General Assembly where nearly all partners participated. The overall project manager Klaus Pressel of Infineon summarized the status and most important steps towards the first f2f meeting project.