NanoWired
NanoWired GmbH is a German high-tech company founded as a spin-off from the Technical University of Darmstadt.
The company has developed a unique nanowire-based surface technology that enables low-temperature joining of electronic parts. Its patented NanoWiring process grows metallic nanowires (e.g., copper, silver, gold) directly onto substrates, allowing the new bonding methods KlettWelding, KlettSintering, and KlettGlueing. In addition to R&D services and prototyping, NanoWired offers production equipment and consumables, enabling customers to implement nanowire technology in their own manufacturing lines. NanoWired cooperates with global partners across Europe, Japan, China, and the U.S..
Role
NanoWired GmbH contributes its nanowire-based interconnect and joining technologies to enable E2Packman electronic packaging with high electrical and thermal performance at low process temperatures.
Key responsibilities include:
- Development of nano-structured metallization layers (Cu, Ag, Au) on various substrates and components for low-temperature, pressure-assisted bonding (KlettWelding and KlettSintering).
- Integration of NanoWiring processes into advanced substrate and module-level assembly flows, supporting partners in developing highly miniaturized and reliable interconnects.
- Characterization and reliability assessment of NanoWired-based joints under thermal and electrical stress.
- Contribution to the exploitation and standardization strategy, focusing on commercial pathways for NanoWired-enabled assembly solutions in the European packaging ecosystem.
Key Contribution
Providing nanowire-based interconnect technology (NanoWiring / KlettWelding) that enables reliable, low-temperature, and high-performance electrical and thermal connections for advanced packaging applications.
