E2Packman

In the E2PackMan project, imec contributes as a leading European research and technology organisation for advanced electronic packaging, supporting the development of next‑generation, manufacturing‑ready packaging solutions.

imec plays a central role in reliability, thermo‑mechanical co‑design, and validation of advanced packaging technologies, helping to de‑risk new integration concepts before industrial deployment. Leveraging its state‑of‑the‑art infrastructure and deep expertise in heterogeneous integration, imec supports the project with system‑level modelling, testing, and lifetime prediction of advanced electronic packages.

A key focus of imec’s work is the co‑design of thermal, mechanical, and electrical aspects of advanced fan‑out packages, as well as the evaluation of low‑temperature and hybrid bonding processes. Through short‑loop experiments and in‑line testing, imec helps validate materials, equipment, and process innovations in close collaboration with industrial partners across the European packaging supply chain.

By acting as a neutral technology integrator, imec bridges materials suppliers, equipment manufacturers, and device makers, contributing to improved traceability, reliability, and manufacturability of advanced electronic packaging. In this way, imec supports E2PackMan’s goal of strengthening Europe’s capabilities in electronic packaging manufacturing and accelerating the transfer of innovation from research to industry Imec is co-leading the WP6 work package on reliability testing strategies for heterogeneous packages.

Imec contributes to E2PackMan with leading expertise in reliability engineering, multi‑physics co‑design, advanced heterogeneous integration processes, and short‑loop validation, enabling robust, manufacturable next‑generation electronic packaging technologies for European industry.