Infineon Technologies Manufacturing Porto

IFMP (Infineon Technologies Manufacturing Porto), is the new site of Infineon in Porto founded in July 2024 with focus on production of leading edge packaging in Europe to produce high quality and high reliable products. This production site includes a close collaboration with ATEP (Amkor Portugal).

With their long term agreement, Infineon and Amkor further strengthen their partnership, extending the classical outsourced semiconductor assembly and test (OSAT) business model.

Infineon historically has a strong link to Porto with its former memory packaging. Main focus of Infineon’s new production site is on security and power technologies supporting CO2 neutral electronics. IFMP is a specialized facility focused on semiconductor and electronic component manufacturing.

Role

In E2PACKMAN IFMP will investigate innovative power packaging based on wide bandgap SiC. In the project R&D for innovative packaging together with IFAG Regensburg will be made. Target of IFMP is to strengthen first production of power packaging in Europe and to secure a SiC value chain in Europe.

IFMP is contributing to WP1 specification and requirements and WP3 investigation of new package materials for power packaging. Major R&D will take place in WP5 Manufacturing and Automation. In WP6 IFMP will investigate reliability and quality of technology. In WP7 IFMP will contribute to the molded module power package technology and related use cases.

Furthermore IFMP will set-up and develop collaboration with Portuguese institutes of the region like INL and INEGI. This will allow to set up a local infra-structure, where not only IFMP but also the whole Northern Portugal microelectronic industry can take advantage.

Key Contribution

IFMP will closely collaborate with IFAG’s assembly and packaging development center in Regensburg. Technologies from Infineon Regensburg will be set-up at IFMP Porto to strengthen power device packaging supporting e.g. the European SiC value chain.