Infineon Technologies Austria AG
Infineon Technologies AG (IFAT) is a subsidiary of Infineon Technologies AG – a world leader in semiconductor solutions for power systems and Internet of Things.
With its products and solutions, Infineon drives decarbonization and digitalization. As a leading company in the semiconductor industry, Infineon drives the development of innovative technologies in the areas of automotive, energy and industrial management, energy-efficient technologies and the Internet of Things.
Infineon Technologies Austria AG pools competencies for research and development, production and global business responsibility. Chips from Infineon play an essential role wherever electric energy is generated, transmitted and used efficiently. As one of the country’s most research-focused companies, about 2,500 of 5,977 employees are working in the field of Research and Development in Austria. In the year 2024 expenses of IFAT in the field of Research & Development were ~686 million Euros, which corresponds to 14% of the business volume. The production at the Villach site is a leading factory for innovative semiconductors and the innovation factory in the global Infineon network.
Role
IInfineon Austria combines innovative research with high-quality production. The Villach fab is capable of working with different wafer diameters, many different substrates and a broad variety of process material. Thus, IFAT contributes its knowledge of silicon power semiconductors and quantum computing devices to the project. IFAT also provides an Innovation Fab for industrial demonstration in production environment.
For years, IFAT has played a leading role in coordinating EU research initiatives to strengthen Europe’s position in the development and manufacture of innovative microelectronics. IFAT will also support the project coordinator with its gained project management expertise.
Key Contribution
- Research on new bonding materials and measurement concepts as well as development of innovative bonding processes leading to more reliable MEMS products with highest thermal and electrical performance.
- Investigation of different bonding processes focusing on hermeticity with poly-Si based interposer wafers.
- Demonstration of an innovative open quantum computing device packaging.
