Infineon Technologies AG
Infineon Technologies AG is a global semiconductor leader in power systems and Internet of Things As a leading company in the semiconductor industry, we enable game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure loT.
Infineon drives decarbonization and digitalization with its products and solutions. The Company had around 57,000 employees worldwide (End of September 2025) and generated revenue of about €14.662 billion in the 2025 fiscal year (ending 30 September).
Infineon Technologies AG pools competencies for research and development, production and global business responsibilities.
Semiconductors are crucial to solve the energy challenges of our time and shape the digital transformation. With our power system solutions, Infineon Technologies AG is a key enabler in the move to harness renewable energy resources and deliver energy-efficient solutions along the entire electrical energy chain. Our technology portfolio includes sensors, microcontrollers, high-performance memories for specific applications, power semiconductors based on silicon (Si), silicon carbide (SiC), and gallium nitride (GaN), as well as components for human-machine interaction and vehicle connectivity. Infineon is the world leader in automotive semiconductors.
With its innovative assembly and packaging solutions, the Infineon Regensburg site is the worldwide innovation R&D centre for assembly and packaging of Infineon.
Role
An experienced industrial consortium member, Infineon Technologies AG will lead this project and the consortium supported by its subsidiary Infineon Technologies Austria AG.
The new advanced packaging technologies in E²PackMan will be developed and prototyped either at Regensburg or at the European research partner’s location. In this project Infineon Regensburg will focus on innovative power packaging, mm-wave sensor package developments, and use the synergy with the consortium to drive packaging for quantum computer with special focus on reliability related improvements. Reliability will play an increasing role towards sustainable electronics the next years. Infineon Regensburg will investigate new production methodologies e.g. supporting of production by computer science like digital twin and AI technologies.
At Regensburg the new methods will be made ready for use in production. The developments in Regensburg will have a close link to the Infineon production sites at Warstein and to the new partnership of Infineon and ATEP in Portugal.
Key Contribution
- Chip embedding for power devices (P1.A )
- Research and development of the packaging of a quantum processing module (low temperature packaging), packaging of research and developing of reliable quantum processor package for ion traps is target (minimized T temperature effect, i.e. extreme temperature stability at low T is required).
- Assembly and packaging of innovative molded multi-chip power packages based on SiC (P2.B), with strong impact on EV and other mobility applications as well as energy.
- Assembly and packaging for fan-out packaging
- Fan-Out technology for acoustic MEMS based sensors with a frequency >1MHz (S1.B)
- In addition
- Supporting of the set-up of Infineon Manufacturing in Porto/Portugal based on E2PackMan package innovations.
- Strengthening capability in Codesign, Modelling and Simulations by cooperation with RTO and universities, but also other industry
- Modelling and simulation for virtual prototyping applying digital twin technologies; design for manufacturing
- Research and development on implementing AI/ML technologies in Assembly and Packaging processes and manufacturing
- Research on reliability of devices (one major enabler for sustainability)
