Fraunhofer IZM
Intelligent electronic systems – available everywhere and to everyone! To make this possible, components need to have exceptional properties Depending on the application, they need to function reliably at high temperatures, be extremely miniaturized and moldable to individual build spaces or even flexible and have outstanding lifetime.
The Fraunhofer IZM helps companies around the world develop and assemble robust and reliable electronics to the very cutting edge and then integrate them into the required application.
With 460 employees, the institute develops adapted system integration technologies on wafer, chip and board level. Research at Fraunhofer IZM means designing more reliable electronics and making reliable lifetime predictions.
Fraunhofer IZM’s research results are highly relevant to industries such as the automotive industry, medical engineering, industrial electronics and even lighting and textiles.
Semiconductor manufacturers and suppliers of related materials, machines and equipment, but also small companies and startups can choose the approach that best suits their needs – from easily accessible standard technologies through to high-end disruptive innovation. As partners, our customers profit from the advantages of contract research, by selecting between exclusive release of a product innovation, improving a workflow or qualifying and certifying a process.
Role
Fraunhofer IZM makes significant contributions across several key areas. As a technology provider for assembly and encapsulation, the institute focuses on compression molding as well as the development of chiplet and flip-chip assemblies. Its initiative towards process digitalization includes the development of an open-source Application Development Kit (ADK) aimed at enhancing manufacturing efficiency. Additionally, Fraunhofer IZM is a leader in the design and characterization of high-speed interconnections for UCIe interfaces. The institute also conducts comprehensive EMI/EMC simulations and measurements to ensure electromagnetic compatibility. Furthermore, Fraunhofer IZM serves as a co-leader of Work Package 4 (WP4) in collaboration with Besi-AT, driving innovative solutions in semiconductor technology.
Key Contribution
Fraunhofer IZM is at the forefront of advanced packaging technology, specializing in High-Performance Computing (HPC) and chiplet assembly and encapsulation. The institute excels in process simulation and modeling for flip-chip assembly and molding processes, ensuring optimized manufacturing workflows. Additionally, Fraunhofer IZM focuses on RF and high-speed design, simulation, and material characterization, extending its capabilities up to terahertz (THz) frequencies. Furthermore, the institute maintains a strong connection to the APECS Pilot Line through its Lab-to-Fab initiative, facilitating the transition of innovative technologies from research to practical application.
Fraunhofer Institute for Reliability and Microintegration IZM
Gustav-Meyer-Allee 25
13355 Berlin
Germany
www.izm.fraunhofer.de
