Fraunhofer ENAS
Fraunhofer Institute for Electronic Nano Systems (ENAS) has 250 employees, is located in Chemnitz (Germany)
The Micro Materials Center (MMC) is the Reliability Department of Fraunhofer ENAS with more the 25 years of experience in applied research on thermo-mechanical effects, risks and failure modes affecting the lifetime of electronic components, modules, and systems.
The department of System Packaging has comprehensive knowledge and experiences in advanced wafer-to-wafer and die-to-wafer bonding for sensor, logic and power electronics as well as MEMS structures in automotive, industrial, and 'new energy' applications.
Role
Co-Leader of WP2 // Advancement of advanced bonding processes and most efficient optimization of thermo-mechanical reliability for very complex components, modules and systems of computer and power electronics in automotive, industrial, and infrastructural use cases:
- New strategies of experimental testing, characterization, and failure analysis
- Hierarchical set of parametric models covering complete portfolios of packages (components and modules)
- Automated virtual DoE assessment by Digital Twins and cascaded Compact Digital Twins (Component – Module – System) for the use with DfR and PHM
- Process dev. for wafer-to-wafer & die-to-wafer bonding
Key Contribution
- Extensive knowledge on electronics package DfR and PHM for high-performance harsh-environment use cases
- Expert in assessing thermo-mechanical reliability including experimental tests and characterization as well as virtual assessment and qualification (product release)
- Pioneer in new numerical modeling and simulation based on automated Finite Element Methods and use of Artificial Intelligence / Machine Learning: Digital Twins, Compact Digital Twins, Cascaded Compact Digital Twins
- Comprehensive know-how in advanced joining processes at wafer-level: glass frit bonding, hybrid bonding – to be contributed to several use cases within the project
