Extoll
EXTOLL develops its own semiconductor IP for high-performance data interfaces and network functionality and serves the worldwide market of ASIC-, SoC- and Chiplet-Makers in various industry segments. EXTOLL pursues its roadmap that perfectly fits into today’s high demands on continued technical excellence and widely anticipated market developments.
EXTOLL is a leading supplier of its innovative high-performance and ultra-low power interconnect technology, primarily aimed at 5G/6G digital beamforming, RF/Radar, edge-AI, advanced embedded and quantum compute applications in aerospace/defense/satellite, communication and automotive markets. Its core solutions are the EXTOLL high-speed and ultra-low power SerDes and UCIe Interconnect IPs, which are developed to address challenges in scalability, bandwidth, and low-latency data communications in demanding computing environments. EXTOLL has ongoing developments in semiconductor IP (SerDes, UCIe, NoC) with smallest footprints and highest PPA in the industry. This is unique in Europe.
Role
Within the role EXTOLL is engaged in various activities and will be focusing on these activities:
- Contribute to the Smart Computing vertical, Platforms for Computing and Communication
- Lead C2.A use case within “Chiplet on Organic advanced substrate Platform”
- Create and provide test-concepts and –chiplets for usage in advanced packaging solutions to build Chiplet-to-Chiplet connectivity test cases based on the new UCIe standard (Universal Chiplet Interconnect Express)
- Enable systems modeling for highspeed interconnect solutions in advanced packages (together with partners)
- Create test-vehicles by integrating test-chiplets in advanced packages together with partners for substrates and assembl
- Perform critical characterization of highspeed interconnectivity within test-vehicles (in collaboration with partners with respect to thermos-mechanical investigations)
Key Contribution
- EXTOLL will lead the C2.A use case which focuses on a chiplet-based architecture for high performance computing & real-time secure communication systems. Within this case EXTOLL plays a major role creating a test chiplet with latest UCIe interconnects that can be also used in harsh conditions typically for automotive and aerospace/satellite segments. The chiplet will be characterized electrically, and thermos-mechanically.
- Moreover, EXTOLL contributes to the C2.B use case where Extoll chiplets will be applied on an organic advanced substrate platform that integrates a memory module.
- In collaboration with partners EXTOLL will perform explorations on advanced systems modelling for high-speed connectivity of chiplet-based architectures in 2D (2.5D, 3D) packages to master complexity.
