European Impact of E2PACKMAN

E2PackMan will strengthen the industrial competitiveness of European electronic components and systems for mobility, energy, and the digital industry by advancing innovation in assembly and advanced packaging production. This will improve the ecosystem for leading-edge electronics and reinforce European competitiveness, sovereignty, and sustainability across the microelectronics value chain.

Advanced Packaging as a competitive advantage

  • Traditional approaches to chip miniaturization are reaching their physical limits (approaching the Ångström era).
  • The use of heterogeneous integration and chiplet concepts will enable European manufacturers to master the challenges of new technologies and demanding use cases.
  • A focus on reliability, quality, and system knowledge in harsh environments will allow European suppliers to differentiate themselves from global competition and secure technological sovereignty.

Strengthening European sovereignty and supply chain resilience

  • Technological Sovereignty: The project is a key pillar for the European Chips Act, aiming to help increase Europe's global share of assembly, test, and packaging from 5% to a strategic 20%.
  • Time to Market: Implementation of simulation-driven co-design and digital twin methodologies will shorten product development times by 30%.
  • Miniaturization and Density: Development of Ultra-High Density (UHD) organic substrates will enable features down to 2 µm, bridging the gap between front-end and back-end technologies.
  • Leadership in Power Electronics: Packaging for Wide Bandgap (SiC and GaN) materials will allow for operation at higher temperatures (>200°C) and increased efficiency in electromobility and energy sectors.
  • Manufacturing Efficiency (Quality 4.0): Integrating AI and Machine Learning into production (e.g., automated optical inspection, anomaly detection in wire bonding) will reduce defects and waste.

Impact on innovation capacity and generating new knowledge

  • Comprehensive Value Chain: Close collaboration among 60 partners from 13 countries—ranging from material and equipment suppliers to end-users—will establish a unique European Advanced Packaging ecosystem.
  • Talent Cultivation: The project aims to secure and create more than 1,000 high-tech jobs by providing interdisciplinary training through summer schools and doctoral programs linked to industrial practice.
  • Link to Pilot Lines: E2PACKMAN acts as an "Accelerator Project," directly transferring research results from European pilot lines (such as APECS/AHSI) into industrial manufacturing.

21 Industrial Pilots and Application Use Cases demonstrate outstanding innovation potential for E2PackMan

  • The industrial pilots are organized into 10 technology platforms covering sensors, communication (5G/6G), computing, and power electronics.
  • These real-world demonstrations will validate the ability of European industry to produce reliable, sustainable, and high-performance products "Made in Europe" for critical global markets.