Ericsson AB
Ericsson is a world leader in the rapidly changing environment of communications technology – by providing hardware, software, and services to enable the full value of connectivity.
Ericsson is a global leader in delivering ICT solutions, 40% of the world's mobile traffic is carried over Ericsson networks. Ericsson has customers in over 180 countries and comprehensive industry solutions ranging from cloud services and mobile broadband to network design and optimization. Ericsson has one of the industry's strongest patent portfolios with a total count of over 60,000. R&D is at the heart of our business and approximately 27,000 employees are dedicated to our R&D activities.
Role
Ericsson will investigate laminate substrate + RDL using sequential build up-covalent bonded metallization as package substrate for chiplet package using wide IO interface, including SI, RF performance and BLR testing.
Key Contribution
Ericsson will provide specification and evaluation of relevant package technology for chiplet design within telecommunication.
