E2Packman

ELES scope is to develop a new test method for the qualification of the new generation Chiplet/Power ICs module assembly and support the creating of aging and degradation models in accurate way, to be used in the simulations and digital twins for reliability prediction, to shorten the design and qualification of new products. The TfR method (Test for Reliability) consists in a combined fast transient thermal stress, electrical power cycling stress, with high voltage / current electrical stress and functional test, allowing to collect with fine granularity and in short timeframe the stress effects, collecting wide statistical data to create accurate digital twin models. The test/measurement data will be collected from the Chiplet/Device itself, as well as from IPs available at module level, allowing to obtain information about the Key Reliability Parameters necessary for the advanced aging and degradation reliability models. One of the key-enabler for the implementation of this methodology is the application of “Design for Reliability Test” Guidelines at chip/module/system’s package design stage.

ELES Semiconductor Equipment S.P.A. plays a crucial role in the project by conducting a comprehensive gap analysis of existing standard testing methodologies and developing innovative DfRT (Design for Reliability Test) methods tailored for both communication and computation devices as well as smart power devices. They define key reliability parameters and integrate the related IP into the device packages to ensure detailed monitoring during service operation. ELES excels in designing and implementing setups for stress and functional tests on materials and semi-finished products, providing critical support in optimizing and fine-tuning test programs. Additionally, they lead the S&R (Stress and Reliability) tests for Power Modules with a focus on thermomechanical electrical tests and fabricate advanced test platforms specifically for the reliability testing of smart power modules. By executing reliability trials using the TfR (Test for Reliability) method, analying test results, and supporting the characterization of aging and degradation models, ELES significantly contributes to the development of accurate digital twin models. Their implementation of TfR leverages rapid transient thermal stress and high voltage/current electrical stress, enabling the collection of extensive statistical data to enhance predictive reliability simulations, thereby accelerating the design and qualification of new Chiplet/Power ICs module assemblies.