Virtual kick-off week

The E2PACKMAN kick-off was organized as a virtual kick-off week from June 30th to July 4th, 2025. It started with a General Assembly where nearly all partners participated. The overall project manager Klaus Pressel of Infineon summarized the status and most important steps towards the first f2f meeting project.

Figure above this text shows the idea of E2PACKMAN. Package diversification leads to two package trends with different main figures of merit. The first trend with main figures of merit high frequency and high data rate with high I/O is driven by digital devices. The second trend has main figures of merit high power, low losses, and low I/O. This reflects the analogue world. The field in the grey area in the middle of the figure reflects the diversification that exists between the two trends.

In the virtual kick-off in specific the importance of this project towards securing the European value chain with assembly and packaging competence was highlighted.

This was in addition stressed by a presentation of the Chips JU office. This overview and status session was followed by short partner pics of all 60 partners. This introduction was important that partners get the right contacts to work in the project.

This figure show a part of Infineon (IFAG) partner pics example. The rest of the week focused on work package sessions and the 21 use cases. For all technical work packages WP1 to WP7 introductory meetings took place to start first coordinated work.

These sessions also included first preparation towards the f2f meeting, which was scheduled during this kick-off for 12-14th of November 2025 at Infineon Regensburg.

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