F2F meeting in Regensburg
Most attention of this 3 days first face to face meeting was to link the work packages with the use cases. The 21 use cases tackle the 10 package platforms (see Virtual Kick-off meeting) identified for Europe. These include the support of packaging for chip-let technologies and advanced power packaging e.g. towards wide bandgap devices. For setting up these use case, toolboxes and toolbox elements were discussed and defined. One target of E2PACKMAN is to set up a technology and material toolbox element catalogue for design and fabrication of EU relevant applications.
The use case pics per partner were updated to align main contributors to the different work packages. In addition, a session of first PhD work that started was included. 1. Innovative protection for MEMS system-in-package (SiP) devices by Verene Wallner, Infineon Technologies AG. 2. Large AI Models for Advanced Packaging by Jialong Liang, Delft University of Technology.
The first f2f included session on all workshops WP1 (Specifications and Requirements) to WP8 (Exploitation and Dissemination). Some workshop like WP2 Design, Modelling and Simulation, WP3 Materials, WP4 (equipment and processes organized), and WP6 Reliability, Quality and Testing organized interactive workshops.
The first f2f meeting was a full success. Through the intense workshop sessions and use case session the partners received a picture of the project set-up. In addition, a very important step to get the first deliverables ready until month M6 was reached.
