EuWoRel 2025

Since 2013, EuWoRel has been the annual forum for addressing the concerns of reliability, robustness, and functional safety of new products and technologies in the field of electronics and smart systems.

EuWoRel 2025 again was special. The EU Pilot Lines and the E2PACKMAN project have started. They aim to bring Advanced Electronics Packaging back to Europe to serve our home industry with own products that endure demanding and harsh environments. 1/3 of the participants were from E2PACKMAN partners. All technical work packages of E2PACKMAN were represented by its leaders or co-leaders. After lunch on the 2nd day the E2PACKMAN team had room for an own workshop.

Analysis of developments

  • Digital (Nvidia/TSMC & Co)
  • Digital & Analog (Communication - Smart Sensors - Smart Power)
  • Analog (IFX, STM & Co) – in between

Positioning of the project in the funding landscape

  • IPCEI = industrial funding
  • APEC & NanoIC, fames = RTO/university funding

E2PACKMAN is as the connecting link

Implementation in E2PACMAN

  • computation & communication
  • Sensors
  • Power

3 use case clusters

Coverage of the entire value chain

  • design & materials
  • equipment & processes & manufacturing
  • Reliability

3 discussion groups

In this context, E2PACKMAN could link to the EPoSS Working Group on Advanced Packaging by discussing next research and innovation priorities in reliability methodology as well as proposing measures to revitalize European value chains for electronics packaging, assembly and testing of the high-performance electronic systems needed in automotive, automation, and infrastructural products Made in Europe.

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