E2Packman

The event brought together partners from across Europe to review the achievements of the project's first year, discuss ongoing technical developments, and coordinate the next steps towards the project's objectives. As one of Europe's leading research institutes in advanced electronics packaging and system integration, Fraunhofer IZM provided an inspiring setting for technical discussions and collaboration.  industrial sectors.

During the three-day meeting, the project coordinator and work package leaders presented updates on project progress, key achievements, ongoing activities, and upcoming milestones. Particular attention was given to developments within the technical work packages covering specifications and requirements, materials and interfaces, advanced packaging technologies, reliability assessment, modelling, and validation activities. The consortium also discussed the E2PACKMAN toolbox concept, which aims to integrate individual project outcomes into a coherent framework and strengthen the links between the different technical activities and industrial use cases.

A significant part of the meeting was dedicated to the presentation of project use cases. Representatives from industry and academia shared their latest results, highlighted technical challenges, and discussed future development plans. These sessions provided valuable opportunities to exchange knowledge, identify synergies between activities, and ensure that research efforts remain closely aligned with industrial needs.

Supporting the next generation of researchers is an important objective of E2PACKMAN. To promote knowledge exchange and professional development, dedicated PhD presentations were organized as part of the General Assembly programme. Verena Wallner (IFAG) presented her work on Innovative Protection for MEMS System-in-Package (SiP) Devices, while Jialong Liang (TU Delft) showcased AI for Reliability in Advanced Packaging. Their presentations stimulated lively discussions and encouraged interaction between young researchers, industrial partners, and experts from different technical domains.

The Berlin General Assembly marked an important milestone for E2PACKMAN. The meeting strengthened collaboration across the consortium, aligned future activities, and reinforced the project's commitment to advancing innovative packaging technologies and supporting a competitive and resilient European microelectronics ecosystem.