National University of Science and Technology POLITEHNICA
The National University of Science and Technology POLITEHNICA Bucharest (UPB) is the largest technical university in Romania and one of the largest in Central-Eastern Europe, with a history spanning over 205 years and an excellent tradition in education and scientific research. Within the E2PACKMAN project, UPB participates through the Centre for Surface Science and NanoTechnology (CSSNT–UPB).
CSSNT-UPB is a relatively young research center, founded in 2011 by Prof. Dr.rer.nat. Marius ENACHESCU, an internationally recognized physicist, being among the pioneers in designing and building STM-AFM systems as basic instruments for atomic and nanoscale surface investigations at the Technical University of Munich (TUM), Germany, between 1990 and 1994. CSSNT-UPB’s experimental research is carried by leading synthesis and characterization of the next generation of micro- and nanomaterials, micro- and nanostructures, and by the fabrication of micro- and nano-devices through its state-of-the-art equipment. CSSNT houses over 18 research and development laboratories (https://eertis.eu/errf-2200-000x-0819), each of them being centered around a high-performance equipment or group of equipment, with certain functionalities, that satisfy the most demanding requirements of nanotechnology, but also many other related fields.
CSSNT-UPB has been and continues to be actively involved in numerous European research projects related to the semiconductor industry, nanotechnology, and advanced materials, including recent initiatives such as NanoIC, 14AMI, 14ACMOS, HICONNECTS, R-PODID, IT2, PIn3S, BEYOND5, R3-PowerUP, and REACTION, to name a few. Through these projects, the center contributes to cutting-edge developments in micro- and nanosystems and reinforces its role as a key metrology partner for innovation and collaboration within the European semiconductor ecosystem.
Role
CSSNT-UPB will contribute to E2PACKAMAN with its expertise in metrology, testing, and reliability assessment for advanced semiconductors. The center will support the development, validation, and optimization of characterization methodologies for packaging materials and components. Activities include surface and structural analyses using AFM, e-beam techniques, µRaman, and HR-XRD for morphology, composition, and stress/strain evaluation, as well as endurance and reliability testing under controlled and harsh environmental conditions. CSSNT-UPB will also develop and refine testing protocols and equipment for electrical, thermal, and mechanical assessments, enhancing measurement accuracy and understanding of material and package performance.
Also, as co-leader of WP8, CSSNT-UPB will support the planning and implementation of dissemination, communication, and outreach activities, ensuring that project results are effectively shared with the consortium, the scientific community, industry, and the wider public.
Key Contribution
CSSNT-UPB’s key activities: (1) advanced metrology and testing for materials, components, and structures relevant to semiconductor packaging; (2) surface and structural characterization using AFM, e-beam techniques, µRaman, and HR-XRD to assess morphology, composition, and stress/strain; (3) endurance and reliability testing of packaging materials and devices under controlled and harsh environmental conditions (temperature, humidity, and gases); (4) development of testing protocols for electrical, thermal, and mechanical evaluation of packaging components; (4) improvement and development of metrology methods and equipment to enhance testing accuracy and reproducibility.
In addition, CSSNT-UPB will contribute to dissemination and communication activities, supporting the promotion of project results and increasing its visibility within the scientific and industrial communities.
National University of Science and Technology POLITEHNICA
Center for Surface Science and Nanotechnology
Splaiul Independentei 313
060042 Bucharest
Romania
cssnt-upb.ro