Consortium Partners
The E2PACKMAN partnership is specifically composed to address the challenges of developing next-generation advanced packaging technologies. It brings together leading European semiconductor manufacturers such as Infineon, STMicroelectronics, Nexperia, Bosch, and Murata; globally recognised material and equipment suppliers; top-tier Advanced Semiconductor Assembly & Test, PCB, and laminate producers; as well as world-class research organisations and universities.
The application perspective is ensured by global players in mobility, energy, and digital industry. The consortium is closely aligned with four European RTO Pilot Lines, with the tightest cooperation established with the ‘Advanced Heterogeneous System Integration’ pilot line, ensuring rapid transfer of new capabilities into industrial deployment. Many partners have a long-standing history of collaboration in European projects, fostering excellent communication, trust, and technical coherence, while newly established links bring fresh perspectives and novel approaches.
The consortium structure reflects the complete advanced packaging value chain, spanning competencies from materials research and process development to production, integration, and validation in demanding application environments. This unique combination of skills, infrastructure, and expertise enables E2PACKMAN to meet the high reliability, quality, and robustness requirements of critical European.