Boschman Technologies BV
Boschman is a high-tech, solution driven Dutch company focusing on advanced power packaging solutions.
We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable sintering and molding processes, the lowest cost of ownership and the shortest time to market.
We are focussing on well-defined high growth market segments for Power Modules in the Automotive and Industrial market with technology leadership in Ag/Cu sintering and film assisted molding supported by our patented Dynamic Insert Technology.
Role
Boschman will develop new technology and methods for pressure sinter applications, support partners in high volume package design for sintering and molding. Boschman will support the partners in the realization of samples for the use cases. For the high-volume pressure sintering and encapsulation processes Boschman develops the required tooling and equipment.
Key Contribution
Boschman uses the experiences gained in the customized power module design of worldwide projects for the design of the use cases for the partners. Our Assembly Lab is well equipped for the in-house realization of the first samples. Leader in solutions for pressure sintering of single chip and large areas sintering (Package Attach Sintering) and transfer molding of power modules.
