BESI AT
Besi is an equipment manufacturer for the advanced packaging industry
Besi Austria GmbH forms part of the Dutch group, BE Semiconductor Industries, N.V., an equipment manufacturer of advanced packaging equipment for the semiconductor industry. BESI Austria’s main area of expertise is the development of high-precision and high-speed die-to-wafer/substrate/die bonding equipment in a wide range of end-user markets including AI, cloud server, computing, and automotive, with over 30 years’ experience.
BESI Austria is industry leader with various machine platforms focusing on modularity and flexibility, whilst still maintaining excellent yield, cost of ownership and extreme placement precision. BESI Austria’s die-bonders are used for high-end semiconductor packaging processes, such as advanced multi-module system in package (SiP) and high-end chiplet systems, copper-pillar flip-chip bonding, thermocompression bonding, and hybrid bonding with sub-micrometer placement accuracies.
As a result, BESI is known throughout the worldwide semiconductor industry as one of the principals and most innovative providers of assembly and die-handling equipment, and as an essential research partner for several research institutes and industrial companies alike. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies.
Role
Besi Austria is coordinator of Work Package 4, Equipment and Processes, within the E2PACKMAN project. In addition, Besi Austria contributes with new equipment and processes for improved bonding accuracy and throughput. Here, Besi’s focus will be thermo-compression bonding for advanced packaging assemblies with new alignment and metrology concepts.
Key Contribution
Beside leading WP4, Besi Austria will contribute to the development of advanced integration processes for low-temperature bonding, allowing the integration of temperature-sensitive electronic parts and in general enabling more energy efficient packaging options. Furthermore, Besi will work on chiplet integration processes, including extreme-accuracy bonding for die-to-die and die-to-wafer applications.
