E2Packman

AT&S’ is developing fine-line organic ultra-high-density substrates to support advanced packaging and chiplet integration. AT&S is also working on chip-last technologies to reduce reliance on non-organic interposers. Chiplets and heterogeneous packaging are particularly important as they enable the modular integration of different technologies, which improves the flexibility, scalability, and performance of complex electronic systems. A key part of AT&S’s involvement includes simulation-driven design and virtual prototyping. We are using digital twins and predictive modeling to optimize package performance, reliability, and manufacturability. AT&S is actively engaged in co-design methodologies that integrate chip, package, and board-level interactions. These methodologies enable a more efficient transition from development to production. This work helps bridge the front-end and back-end semiconductor domains, contributing to a more unified design and manufacturing process. Through these efforts, AT&S supports the broader goals of E2PACKMAN to strengthen Europe’s capabilities in microelectronics packaging.

AT&S is advancing fine-line organic ultra-high-density substrates to address key challenges in miniaturization and next-generation packaging technologies. A core focus lies in developing and enabling organic substrates that meet the demands of future packaging solutions. This includes pushing the boundaries of feature miniaturization—such as line/space and via dimensions—to position organic substrates as viable alternatives to inorganic interposers and RDL technologies.

Leveraging our advanced manufacturing capabilities and deep production expertise, AT&S delivers high-end IC prototypes tailored to a variety of use cases within the project.

Our sophisticated simulation capabilities drive innovation in virtual development, simulation-driven design, and reliability modeling. AT&S is also actively engaged in co-design methodologies across the entire system stack, ensuring a seamless transition from development to production. This integrated approach helps bridge the gap between front-end and back-end semiconductor domains, contributing to a more unified and efficient design-to-manufacturing process.

By combining development, design, and production under one roof, AT&S serves as a strategic co-development partner across multiple use cases and work packages. Our contributions support the broader mission of E2PACKMAN to enhance Europe’s leadership in microelectronics packaging.

1. Substrate Innovation
   AT&S is developing fine-line organic substrates with 2 µm line/space and 10 µm vias, aiming to push toward 1 µm line/space. These substrates are not available today and represent a major leap in miniaturization and integration for chiplet and SiP (System-in-Package) technologies.
2. Chip-Last Technology
   Pioneering chip-last integration on organic substrates, enabling the use of organic materials instead of more expensive interposers or RDLs (Redistribution Layers).
3. Advanced Packaging Use Cases
   AT&S is a core partner in several use cases, especially with Chiplet on organic advanced substrate.
4. Bridging Front-end and Back-end
   AT&S is working in tandem with the partners to bridge the 0.5–2 µm gap between front-end silicon and back-end packaging, a critical interface for next-gen advanced packages.
5. Simulation and Virtual Verification
   AT&S develops detailed material models for its organic substrates and applies them in simulation-driven design workflows to evaluate and optimize package performance, manufacturability, and reliability.