ASML
ASML is a European based global leader in Lithography systems.
Heterogeneous integration, Fan out, 2.5D and 3D packaging technologies require new systems to meet the increasing demands in volume, affordability and technology. With a strong presence in the front end semiconductor industry where customers are also exploring Advanced Packaging ASML is in an excellent position to explore and investigate the Litho contribution to Advanced Packaging.
Role
With a strong presence in the front end semiconductor industry where customers are also exploring Advanced Packaging ASML is in an excellent position to explore and investigate the Litho contribution to Advanced Packaging.
Application development and capability demonstration of an up to now not existing tool to bridge the Assembly & Packaging and Front End IC manufacturing world in a cost effective way Tool should have the intrinsic capability to grow with future requirements by means of upgrades and updates.
Key Contribution
ASML will develop an innovative tool: Application development and capability demonstration of a currently not existing tool to bridge the Assembly & Packaging and Front End IC manufacturing world in a cost effective way. Tool should have the intrinsic capability to grow with future requirements by means of upgrades and updates; First scanner tool worldwide to achieve 0,5 -2 um line/space. This tool perfectly bridges the gap between advanced silicon front-end technology and package technology
- Innovative iLine equipment for RDL on Si carrier (link to APECS pilot line)
- ramp to HV and Investigating boundaries of iline and determining which other wavelengths will be required by further shrink
- Alternative substrates like panels might be more mainstream requiring different handling solutions
