3Dis Technologies
3DiS Technologies SAS is a young technology company that offers innovative Wafer-Level 3D packaging and 3D interconnect solutions for the integration of miniaturized electronic systems and high-performance, ultralow-profile, 3D inductive passive devices.
By using these innovations, 3DiS promises to enhance electrical and thermal performance of systems while reducing their size by means of dense 3D interconnects and native 3D interconnection of stacked dies.
3DiS Technologies delivers the best solution tailored to the constraints of client's system requirements by relying on its process flexibility & adaptability, its expertise in RF circuit/passive devices design and integration as well as in process engineering. The company is actively committed to providing turn-key system packaging and 3D inductive device integration solutions to customers seeking to fulfil the requirements of today's highly integrated and miniaturized systems. Developed solutions are mainly addressing RF devices and sensors, such as Wi-Fi, 5G/6G RF Frontends, car radars, MEMS etc. with operating frequencies starting from few GHz up to 300GHz.
Role
3DiS will provide wafer-level-packaging services, especially, RDL, 3D-RDL and Cu pillar plating at singulated die level or in Fan-In and Fan-out configurations.
Key Contribution
3DiS’s key contribution will be under T4.2.2 : Chiplet integration and bridges to evaluate replacement of wirebond interconnects in singulated dies by Cu RDL. In addition, 3DiS leads Task T4.4.2 on New Technologies development.
3DiS Technologies
478 rue de la Découverte
Mini Parc 2 - CS 67624
31676 Labèg
France
